Abstract: The scale of joints shrinks continuously due to super small and extremely fast computing devices consent to Moore's Law. Copper-to-copper direct bonding appears to be one of a solution to ...
Abstract: In order to scale wafer-to-wafer hybrid bonding to sub-micrometer pitches, a tight control of surface topography after CMP is required. The post CMP Cu pad recess with respect to the bonding ...
It is a collection for managing vaulted Ansible inventories. It helps to rekey all encrypted variables in the inventory repository. Can also be used to encrypt variables from clear text. Thus, without ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results