Broadcom Inc.’s 3 nm 400 G/lane optical PAM-4 digital signal processor (DSP) is now available, designed for next generation ...

The collaboration addresses one of the most significant challenges in large-scale electrification: reducing energy losses and ...

GOWIN Semiconductor has launched its next-generation Arora GW1AN and GW3A field-programmable gate array (FPGA) families, ...

Arduino launched its latest platform at Embedded World 2026 called Ventuno Q, powered by Qualcomm Dragonwing IQ-8 series. Arduino, which was acquired by Qualcomm in October of 2025, said the single ...

Starlink, in a partnership with Deutsche Telekom, will bring mobile communications to areas where network expansion is difficult or challenging though satellite communications (SATCOM).

Texas Instruments (TI) and Nvidia are collaborating on new semiconductors that will accelerate the path from simulation to the deployment of humanoid robots. Under the deal, TI’s real-time motor ...

Over the decades, PEI-Genesis expanded across North America, Europe and Asia, building a global footprint supported by industry-leading connector expertise, rapid cycle times and a reputation as a ...

Artificial intelligence (AI) solution provider Innodisk presents a comprehensive portfolio designed to accelerate real-world edge AI deployment for industrial applications at Embedded World 2026 in ...

Originally developed in response to labor shortages in poultry processing plants amid the COVID-19 pandemic, the ChicGrasp is now a robotics system capable of learning by imitatin ...

Shimadzu Scientific Instruments has introduced an on-line total organic carbon (TOC) analyzer designed to meet ultrapure ...

Made up of autonomous, Lego-like modules, each component of the legged metamachines features its own circuit board, battery ...

Hyundai Motor Company, in collaboration with Kia, Hyundai Rotem, Hyundai Mobis and the National Fire Agency, created its ...