Circuit stitching between the exposure fields is challenging the design, yield and manufacturability of the high-NA (0.55) ...

Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.

On-Chip Training and Inference with Conductive-Metal-Oxide/HfOx ReRAM Devices” was published by researchers at IBM ...

A new technical paper titled “Towards Mixed-Criticality Software Architectures for Centralized HPC Platforms in ...

A new technical paper titled “Statistics of EUV exposed nanopatterns: Photons to molecular dissolutions” was published by ...

A new technical paper titled “Unraveling the Reaction Mechanisms in a Chemically Amplified EUV Photoresist from a Combined ...

A new technical paper titled “Performance, efficiency, and cost analysis of wafer-scale AI accelerators vs. single-chip GPUs” ...

HBM compatibility vs. customizability; 3D-IC marks shift for EDA; AI ToF decoding; AI-defined vehicles; genAI in EDA.

Just because the various components in an advanced package work individually and separately doesn't mean they will work ...

Evolving lithography demands are challenging mask writing technology, and the shift to curvilinear is happening.

Moving data is one of the big challenges in the AI world. There is so much data being generated that even moving it back and ...

The choice of DRAM depends on where the action is.