Hybrid bonding is gaining traction in advanced packaging because it offers the shortest vertical connection between dies of similar or different functionalities, as well as better thermal, electrical ...

CHARLOTTE, N.C., Feb. 13, 2023 /PRNewswire/ -- Obligees requiring physical bond copies with handwritten signatures are slowly becoming a thing of the past. With Jet Insurance Company's newly launched ...

The fused bonding process developed at the German Aerospace Centre uses reactive joining surfaces to produce reliable bonds, the result being bonded components as if produced from a single mould. In ...

New Orioles manager Brandon Hyde is seeking ways to familiarize himself with his players, the minicamp earlier this month in Sarasota and Saturday's FanFest event at the Baltimore Convention Center ...

A new type of 3D-printed adhesive could change how we join materials together. So far, scientists have developed two new methods that can create extremely strong bonds at the pore level, eliminating ...

AMD is facing two patent infringement lawsuits filed by Adeia, a U. S. -based intellectual property company specializing in semiconductor bonding and interconnect technologies.

Adeia has filed a pair of patent infringement lawsuits against AMD in the U.S. District Court for the Western District of ...

IC Interconnect said its Ni/Au (nickel/gold) pad resurfacing process for automotive and other wire bond applications produces bonds that are stable at high temperatures despite having a thinner gold ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (TOKYO:4004) (President: Hidehito Takahashi, hereinafter “Resonac”) has developed a temporary bonding film to be used for supporting a wafer on a glass ...